News
Samsung, Sun team for ultra-endurance SSD flash memory for server apps 7/17/2008
Offering what they said is a five-fold increase in data write-and-erase cycles over standard single-level-cell (SLC) flash memory, Seoul, South Korea-based memory giant Samsung Electronics Co Ltd and Santa Clara, Calif.-based software, systems, services, and microelectronics maker Sun Microsystems have collaborated on the development of an SLC NAND flash memory device for use in solid state drives that offers much higher endurance levels than any other flash memory device on the market today.AMD ousts Ruiz after $1.2B charge, names Meyer president and CEO 7/17/2008
Following the announcement that its Q2 net loss was worse than expected, Sunnyvale, Calif.-based microprocessor maker Advanced Micro Devices elected president and COO Dirk Meyer to president and CEO, succeeding Hector Ruiz. We are in the midst of re-shaping AMD’s business model with the goal of delivering sustained profitability through a focus on the core technologies that differentiate AMD,” Meyer said.Intel issued second Statement of Objections by European Commission 7/17/2008
The European Commission (EC) has sent a second Statement of Objections (SO) to Intel Corp today, meant to reinforce the Commission’s preliminary view outlined in its first SO sent one year ago that accused Intel of infringing EC Treaty rules on abuse of a dominant position with the aim of excluding its main rival AMD from the x86 CPU market. Intel said it is disappointed to receive a second SO, and is confident its response will show that the allegations in the SO are unfounded.Semi technology, business models converging, IBM’s Meyerson says 7/16/2008
Semicon West: Noting IBM's just announced $1.5B fab, R&D, and capital equipment investments, VP Bernie Meyerson tells a keynote audience that the news is “really about the challenge of keeping this industry going. The challenges are technical and the challenges are to the business model.” According to Meyerson, the future's pervasive semiconductor technology will be highly integrated, driven by architectural advancements, done by collaborative R&D partnerships.UMC chairman, CEO Jackson Hu resigns 7/16/2008
UMC immediately filled the seats, reporting that Stan Hung has been elected as chairman and Shih-Wei Sun will take over the position of CEO.Executive Q&A
Voices: Synopsys’ Aart de Geus on investing to win 6/12/2008
EDA leader discusses 'Frankenstein' flows, multicore trends, and the economy's impact on IC design.Direct-write e-beam system shows major promise for volume production 5/30/2008 7:00:00 PM
In a paper delivered at the International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication, eShuttle lifts the curtain on a technology shift that could take the e-beam technology far beyond the world of prototyping.IMEC, Renesas research reconfigurable RF transceivers 5/28/2008
Renesas has joined IMEC's software defined radio front-end program to research new technologies for multi-standard RF transceivers and early realization of next-generation mobile phones.University working to create nanostructures to raise thin-film solar cell efficiency 5/16/2008
Researchers at the University of California, San Diego led by Professor Edward Yu are working to create thin-film “single junction” solar cells with 45% sunlight-to-electricity conversion efficiencies by using nanostructures that scatter and channel light.NASA supercomputer to get boost from Intel, SGI 5/8/2008
Intel, SGI, and NASA have announced a project that aims to produce a dramatic increase in the space agency's supercomputing capacity.Business Advice
Distributors look to shine with HB-LED opportunity 6/26/2008
HB LEDs (high-brightness light-emitting diodes) hold great opportunity for the electronics supply chain and are particularly attractive to distributors, as the technology will require full-system approaches from suppliers and manufacturers. Analysts estimate that general illumination, signs and displays, and automotive applications will push HB LEDs' high-growth opportunities for driver ICs fr...ROHS DecaBDE exemption ending 6/26/2008
After a challenge from Denmark and the European Parliament, the European Commission-granted EU ROHS (European Union restriction-of-hazardous-substances) exemption for DecaBDE (decabromodiphenyl ether) will end on July 1. DecaBDE is a common flame retardant used in various components and electronics, including HIPS (high-impact-polystyrene) enclosures, polyethylene-wire insulation, and PBT (poly...Cadence's beat 12/18/2007
Electronic News/EDN recently sat down with Mike Fister, president and CEO of Cadence Design Systems Inc. and the former senior VP and general manager of Intel Corp.'s enterprise platforms group, to discuss the EDA industry, work across the capital-equipment value chain, and life after Intel.Inside Intel: Where next? 10/23/2007
In this second of two parts, Dadi Perlmutter, senior vice president and general manager of Intel’s Mobility Group, sounds off on the company’s plans to expand the Intel Architecture into new markets and the developments that will play a key role in making that happen.Special Report: Inside Intel 10/16/2007
First of two parts: The world's biggest processor maker takes aim at data centers and consumer electronics with its new low-power chips and on-board graphics. Pat Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group, sat down with Electronic News to talk about the company's new target markets, integrated graphics and the next big thing.Research Analysis
